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      Technology Leadership Awards

      Technology Leadership Awards Winners Announcement

      The winners have been announced for the most prestigious design contest in PCB—the Technology Leadership Awards by Mentor, a Siemens Business

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      What's new in PCB

      See What’s New

      The latest VX.2.8 release of Mentor PCB products address the increasing complexity of today's advanced PCB designs.

      What's new in Xpedition

      What's new in IC Packaging Design

      What's new in HyperLynx

      Discovery Webinar Series

      Discovery Webinar Series

      Learn how to minimize risk with optimized systems verification methodologies

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      PCB Analysis and Verification Solutions

      Mistakes happen – find them faster with Mentor’s shift-left design methodology

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      Xpedition Enterprise

      Xpedition® Enterprise

      Integrated flow for the global enterprise, from system design definition to manufacturing execution

      Learn more about Xpedition

      Xpedition IC Packaging Design

      Xpedition IC Packaging Design

      Complete solution for High Density Advanced Package (HDAP) rapid prototyping assembly, physical design, verification, signoff, and modeling

      Learn more about Xpedition IC Packaging Design



      A complete suite of analysis and verification software which meets the needs of PCB engineers at any point in the board design flow

      Learn more about HyperLynx

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